X-Tek - Revolution

revolution :

The Revolution is the easiest to use, most cost effective, high quality inspection system on the market. The Revolution is designed specifically for use on production lines and in failure analysis laboratories. Intuitive software allows operators to visualize the most demanding defects.

We believe this is a revolution in performance and price.

Designed for 100% BGA and µBGA inspection, multilayer board inspection and PCB solder joint inspection.

description :

NanoTech Transmission X-Ray Source

160kV Integrated X-Ray Tube

11lbs capacity 5-axis fully programmable manipulator

360 degrees continuous rotation

Maximum scan area 16" x 16" (400mm x 400mm)

Geometric Magnification up to: 2400x

System Magnification up to: 6000x

typical applications :

Advanced automatic inspection of

Electronic components
PWB/PCB inspection
Foreign object and particulate matter identification
High speed pass / fail analysis of BGA components

Manual inspection of

Electronic components
PWB / PCB inspection
F.A. applications
Production verification
Production line setup
Batch inspection (high volume production)

Other

Medical
Automotive
Aerospace
Pharmaceutical
Military

main features :

Compact

Maximum magnification - 6000x

The transmission target design fitted to the Revolution’s X-ray source has an ultra thin output window that enables samples to be safely placed within 250 microns of the focal spot providing up to 6000x system magnification.

High Resolution - Micron Level Features

A tightly controlled microfocus x-ray spot and the latest digital imaging technology ensure that the Revolution produces sharp images of micron level features even in the most challenging samples. The advanced electromagnetic lens is computer controlled to ensure that the image remains in focus at all kV settings and the target does not burn when using high power.

High Penetration - 160kV

MThe patented X-Tek Xi "Open Tube" x-ray source is smaller than any other design and allows x-ray images of fine detail in thick and dense samples to be seen with ease. This high energy vacuum de-mountable unit allows views at steep angles through solder joints and heatsinks without ever running out of energy.

true concentric imaging :

true parallel tracking for bga applications :

A combination of tilt and rotate is required to give the best unobstructed view of BGA balls. The next step is to scan along the rows to inspect for failures. With standard manipulators, this necessitates the simultaneous operation of 3 axes - requiring considerable skill on behalf of the operator.

X-Tek's true parallel tracking maintains the X and Y axes parallel to the BGA, allowing the rows to be scanned using a single X or Y axis. This feature is enabled as part of the advanced system control concept.