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| bga balls (angle view for open ball inspection) |
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Using a viewing angle of up to 75° while rotating the component 360°, our systems can easily find lifted or non-collapsed balls and sometimes even diminutive cracks on the balls. |
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| shorts on a bga |
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A top view inspection is normally used to look for bridges or shorted balls. Using our latest iXS software we can also calculate area, roundness, surface smoothness, position, etc., of every ball; all this by a single mouse click. |
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| void calculation on a bga |
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Using our advanced void calculation software we can accurately calculate void percentage of every ball in a BGA in record time. At the end of the inspection the void calculation data can be exported to a database by a single click mouse. |
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| bond wires |
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Our high-resolution systems can produce nice and sharp images of bond wires that are only a few microns thin. This way, finding broken wires, lifted bonds, etc., is incredibly easy. Our software can also do wire sweep calculation and real-time measurements. |
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| die attach |
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Die attach inspection requires advanced manipulation capabilities which are standard in most of our systems. Typical defects that can be found with x-rays are delamination, excessive voiding on the epoxy, cracks, etc. Our software can calculate the void percentage of the die surface and it can also take on-the-fly measurements. |
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| flip-chips |
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Flip-chip inspection requires high-resolution, high magnification and very precise sample manipulation. The typical defects found on flip-chips are bridges, excessive voids and open connections. |
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| electromechanical, medical devices |
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Our systems can also be used to inspect a wide range of non-electronic components. Applications in automotive, aerospace, medical, electromechanical fields usually use x-ray inspection to perform failure analysis, process evaluation, etc. |
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